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HM6708AP-15 Featured Image
  • HM6708AP-15

HM6708AP-15

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Manufacturer HITACHI LTD
Part Package Code DIP
Package Description DIP, DIP24,.3
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 15 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T24
JESD-609 Code e0
Length 29.88 mm
Memory Density 262144 bit
Memory IC Type STANDARD SRAM
Memory Width 4
Number of Functions 1
Number of Ports 1
Number of Terminals 24
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64KX4
Output Characteristics 3-STATE
Output Enable NO
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BICMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

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