HD74LV2G74AUSE

Manufacturer	RENESAS ELECTRONICS CORP
Part Package Code	SOIC
Package Description	VSSOP, TSSOP8,.12,20
Pin Count	8
Reach Compliance Code	compliant
HTS Code	8542.39.00.01
Family	LV/LV-A/LVX/H
JESD-30 Code	R-PDSO-G8
JESD-609 Code	e0
Length	2.3 mm
Load Capacitance (CL)	50 pF
Logic IC Type	D FLIP-FLOP
Max Frequency@Nom-Sup	45000000 Hz
Max I(ol)	0.006 A
Moisture Sensitivity Level	1
Number of Bits	1
Number of Functions	1
Number of Terminals	8
Operating Temperature-Max	85 °C
Operating Temperature-Min	-40 °C
Output Polarity	COMPLEMENTARY
Package Body Material	PLASTIC/EPOXY
Package Code	VSSOP
Package Equivalence Code	TSSOP8,.12,20
Package Shape	RECTANGULAR
Package Style	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method	TR
Peak Reflow Temperature (Cel)	260
Prop. Delay@Nom-Sup	17.5 ns
Propagation Delay (tpd)	42.5 ns
Qualification Status	Not Qualified
Seated Height-Max	0.9 mm
Supply Voltage-Max (Vsup)	5.5 V
Supply Voltage-Min (Vsup)	1.65 V
Supply Voltage-Nom (Vsup)	1.8 V
Surface Mount	YES
Technology	CMOS
Temperature Grade	INDUSTRIAL
Terminal Form	GULL WING
Terminal Pitch	0.5 mm
Terminal Position	DUAL
Time@Peak Reflow Temperature-Max (s)	20
Trigger Type	POSITIVE EDGE
Width	2 mm
fmax-Min	110 MHz

Product Detail

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